QFN20, 4x4, 0.5P
CASE 485E
ISSUE C
DETAIL B
ALTERNATE CONSTRUCTIONS
DETAIL A
OPTIONAL CONSTRUCTIONS
DIMENSIONS: MILLIMETERS
For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DATE 13 FEB 2018
NOTES:
- DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
- CONTROLLING DIMENSION: MILLIMETERS.
- DIMENSION b APPLIES TO PLATED TERMINAL FROM THE TERMINAL TIP.
- COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
| DIM | MILLIMETERS | |
|---|---|---|
| MIN | MAX | |
| A | 0.80 | 1.00 |
| A1 | --- | 0.05 |
| A3 | 0.20 REF | |
| b | 0.20 | 0.30 |
| D | 4.00 BSC | |
| D2 | 2.60 | 2.90 |
| E | 4.00 BSC | |
| E2 | 2.60 | 2.90 |
| e | 0.50 BSC | |
| K | 0.20 REF | |
| L | 0.35 | 0.45 |
| L1 | 0.00 | 0.15 |
GENERIC MARKING DIAGRAM*
XXXXXX = Specific Device Code
A = Assembly Location
LL = Wafer Lot
Y = Year
W = Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
DESCRIPTION:
(Note: Microdot may be in either location)
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
QFN20, 4X4, 0.5P
This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ ”, may or may not be present. Some products may not follow the Generic Marking.
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